Philip McKay is the chair of the patent and intellectual property and internet groups. For 14 years prior to joining Hawley Troxell, Mr. McKay was a founding partner at Gunnison, McKay & Hodgson, LLP, a patent firm in Monterey, California. Mr. McKay has also worked as a managing in-house patent counsel for a Fortune 100 Corporation where he supervised multiple patent attorneys and oversaw the patent programs of the hardware and research(labs) divisions to develop one of the largest patent portfolios in Silicon Valley. With over 25 years of experience, Mr. McKay has personally prepared and prosecuted hundreds of domestic and foreign patent applications. Mr. McKay also has extensive experience helping clients achieve strategic business objectives by providing strategic technology positioning and portfolio management counseling to companies throughout the world and in a wide array of technology sectors.
Mr. McKay is licensed to practice law in California, Texas, Washington, The District of Columbia, and before the USPTO.
- Business Law
- Intellectual Property and Internet Law
- Mergers and Acquisitions Law
- Patent and Emerging Technology Law
LAW SCHOOL: University of Southern California Gould School of Law, J.D., 1993
USC Tax and Interdisciplinary Law Journal, Editor and Senior Editor
UNDERGRADUATE: University of California, Los Angeles, B.S., Physics, cum laude, 1990
Veterans of Foreign Wars
Artificial Intelligence (AI) and Machine Learning (ML); Cloud-based architecture, security, and services; SIEM; cloud implemented financial management and highly sensitive data processing architectures; cluster computing; distributed storage systems; “Big Data” processing, utilization, visualization and monitoring; boundlessness multiple platform MFA systems; IOT; user experience and customer retention/acquisition; general software applications and systems; mobile applications and infrastructure; business methods; platform/software as a service systems; microprocessor architecture and design; traditional and low power circuit design and fabrication; solid-state memory system design; wafer scale design and fabrication; IC packaging; computing system architecture; LASER and optical devices and infrared LASER sighting systems; peripheral devices and drivers; video compression; refrigeration/heat dissipation technology; mechanical devices; and medical devices.